2008 17th World Conference on Nondestructive Testing
September 22, 2008
September 22, 2008
Spellman High Voltage Electronics Corp. and Spellman High Voltage (SIP) Co. Ltd. are proud to announce that they will be exhibiting at the upcoming 17th World Conference on Nondestructive Testing, to be held on October 25-28, 2008 in Shanghai,
China, at the Shanghai Exhibition Center, Booth C355.
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October 07, 2026
Spellman High Voltage Electronics Corporation, a leading manufacturer of custom high-voltage power conversion products and X-ray sources, will exhibit at PACK EXPO International 2026, taking place October 18 – 21 at McCormick Place in Chicago, IL.
September 30, 2026
Spellman Introduces MMB 6–9kW Monoblock® X-Ray Source for Advanced Medical Imaging Applications
September 29, 2026
Hauppauge, NY - Spellman High Voltage Electronics Corporation will exhibit at the 2026 Annual ASNT Conference, taking place October 12–15 in Columbus, Ohio.
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