Abrazadera electrostática (E CHUCK)

In semiconductor and liquid crystal panel manufacturing processes, vacuum chucks and mechanical chuck systems have conventionally been used to secure the substrate for handling. However, due to the effects of adsorption, distortion and a requirement for improved reliability, chucks that utilize electrostatic force have been widely adopted in today’s generation of semi fab equipment to overcome these limitations. An electrostatic chuck consists of a platen with surface electrodes which are biased with high voltage to set up an electrostatic force between the platen and the wafer. Two types of electrostatic chucks are available: the Coulomb and Johnsen-Rahbek (J-R) types. These are distinguished by their dielectric characteristics and, therefore, the way the clamping force is generated. A Coulomb chuck functions like a conventional dielectric capacitor. The J-R type has a large but finite resistance, so current flows through it and the substrate when the surfaces are in close contact and voltage is applied. Charge accumulates at the interface between substrate and dielectric which provides the clamping force.. . In addition, different configurations of electrodes (or poles) on the chuck are used to get different characteristics. Monopolar, bipolar (two poles) and multipolar chucks (including 6 phase hexapolar types) are available depending on the application. Spellman can provide power supplies for the complete range of e-chucks with features that include: • high-voltage bipolar outputs (positive/negative), • output polarity reversal functions for easier wafer chucking/de-chucking, • capability to detect the state of the wafer by capacitance measurement (Coulomb chucks) or current measurement (J-R chucks), • analogue and digital interfaces for easy integration into a variety of systems • high reliability, mechanical relay free designs. Spellman offers extensive design knowledge and manufacturing capabilities, and so can provide a broad range of customized products to satisfy a variety of requirements. Depending on the application this may also include options such as high voltage biasing/offset and R.F. filtering.

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Generación de Plasma

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Evaporación por rayos de electrones

High voltage power supplies for e-beam evaporation systems, designed for stable deposition, configurable arc intervention, fast slew rates, and multi-channel chamber setups.

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Panel plano

Spellman High Voltage has been the preferred provider of high voltage power supplies for ion beam implanters used for flat panel display fabrication for over three decades. Spellman’s SL Series from 1kV-360kV @ 10 watts to 2000 watts have outfitted implanters around the world. Special customization allows the units to operate in the extreme environment typical for ion beam implantation. Spellman’s ST Series from 1kV-225kV @ 12kW, with parallel operation allowing powers of 100kW’s or more power the implanters of both today and tomorrow.

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Pulverización

While there are many different types of plasma sputtering processes, all with different power supply demands, one of the most important requirements for almost all of them is response to arcing. This is important for stable and consistent sputtering processes. Spellman has many years of experience optimizing our standard rackmount and modular power supplies for use in sputtering, for instance, by limiting stored energy and tailoring arc recovery times. Due to the wide range of requirements for plasma sputtering power supplies, we encourage you to contact our applications experts to discuss your unique specifications.

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Haz de electrones/iones de precisión

Electron beam and focused ion beam applications, while quite different, require very specialized high voltage power supplies with similar performance characteristics. The most critical requirements include ultra-low output ripple, excellent regulation, high stability, low temperature coefficients and high accuracy. The task becomes even more challenging since typical e-beam and FIB power supplies consist of a variety of ground based and floating outputs. Spellman has unparalleled experience designing and building products that not only meet these demanding specifications, but that are robust and reliable for long term, trouble free operation. The Spellman VS100 and FIB Series shown below are representative of the products that we offer for these unique applications. Feel free to contact us to discuss custom requirements or solutions.

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Ion Implantation

Spellman High Voltage has been the preferred provider of high voltage power supplies for ion beam implantation for over three decades. Spellman’s SL Series from 1kV-360kV @ 10 watts to 2000 watts have outfitted implanters around the world. Special customization allows the units to operate in the extreme environment typical for ion beam implantation. Spellman’s ST Series from 1kV-225kV @ 12kW, with parallel operation allowing powers of 100kW’s or more power the implanters of both today and tomorrow.

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Deposición de películas delgadas

There are a variety of thin film deposition techniques, many of which require high voltage DC power. Two very common thin film processes are sputtering and electron beam evaporation (e-beam evaporation). Spellman offers both general purpose and application specific power supplies for both techniques. Spellman’s EVA Series is an ideal choice for e-beam evaporation systems. Designed using efficient and robust solid state circuit topologies, these supplies are highly tolerant of arcing and offer user configurable arc management settings that can be optimized for different processes and deposition conditions, to help maintain consistent and defect free coatings. The EVA Series power supplies are available in different configurations, including integrated filament supplies and multiple outputs, providing unmatched economy and flexibility. As with e-beam evaporation power supplies, tolerance of and response to arcing is important for stable and consistent plasma sputtering processes. Many of our standard rack mount and modular supplies can be optimized for use in sputtering, for instance by limiting stored energy and tailoring arc recovery times. Due to the wide range of requirements for plasma sputtering power supplies, we encourage you to contact our applications experts to discuss your unique specifications.

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Microscopios electrónicos de barrido (SEM)

Spellman’s extensive knowledge in this application has enabled us to develop a range of technology platforms that can be customized to meet demanding customer Electron Beam requirements. Spellman’s EBM range has solutions that will drive most emitters, including thermionic emitters such as Tungsten and LaB6, and Field Emission types such as Cold Cathode and Schottky. All products are provided with the integral outputs to provide the acceleration voltage and drive the emitter, and many also include the HV outputs to drive the many detectors deployed on the Microscopes. With Spellman’s exceptional performance built-in, including low ripple and low micro-discharge, and sub-ppm level stability, the customer is guaranteed the ultimate image quality and resolution, from a repeatable and reliable source... Spellman. Download our short form Ion-Beam/Electron-Beam Brochure, click here.

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Haz de iones focalizados (FIB)

Spellman ha desarrollado nuestra gama de FIB (Focused Ion Beam por sus siglas en inglés) con suministros de alto voltaje integrados para operar la columna completa de haz de iones con el desempeño requerido para lograr una resolución en nm. La gama de FIB incorpora voltajes de acelerador de alta estabilidad con las salidas flotantes para operar fuentes de iones de Ga tradicionales, junto con plasma y muchos otros materiales cuando se combina con tecnologías de filtro Wien, en una solución de bastidor de 19 pulgadas. Hay un bastidor de lente adicional disponible que proporciona lentes de alto voltaje de polaridad fija o reversible de alto desempeño requeridos para enfocar la columna.

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Depósito físico de vapor

La deposición física de vapor es un término que cubre una variedad de técnicas de deposición de película delgada, muchas de las cuales requieren alimentación de DC de alto voltaje. Dos procesos muy comunes de PVD son la pulverización catódica y la evaporación por haz de electrones (evaporación por haz electrónico). Spellman ofrece fuentes de alimentación de propósito general y específicas de aplicación para ambas técnicas. La Serie EVA de Spellman es una opción ideal para sistemas de evaporación de haz electrónico. Diseñados utilizando topologías de circuitos de estado sólido eficientes y robustas, estos fuentes son altamente tolerantes al arco y ofrecen configuraciones de gestión de arco ajustables por el usuario que se pueden optimizar para diferentes procesos y condiciones de deposición, para ayudar a mantener recubrimientos consistentes y libres de defectos. Las fuentes de alimentación de la serie EVA están disponibles en diferentes configuraciones, incluidas las fuentes de filamento integradas y múltiples salidas, lo que proporciona una economía y flexibilidad inigualables. Al igual que con las fuentes de alimentación de evaporación de haz electrónico, la respuesta al arco es importante para procesos de pulverización catódica de plasma estables y consistentes. Muchas de nuestras fuentes modulares y de montaje en rack estándar se pueden optimizar para su uso en pulverización catódica, por ejemplo limitando la energía almacenada y adaptando los tiempos de recuperación del arco. Debido a la amplia gama de requisitos para las fuentes de alimentación de pulverización catódica por plasma, le recomendamos que se ponga en contacto con nuestros expertos en aplicaciones para analizar sus especificaciones únicas.

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Pruebas de alto voltaje

Spellman ofrece una amplia gama de soluciones de alto voltaje para pruebas de semiconductores, desde módulos de montaje en PCB con control analógico, hasta unidades de montaje en rack con control digital con alta estabilidad, bajo rizo, protección contra arcos y cortocircuitos. Spellman tiene la tecnología, ya sea que requiera alta / baja potencia, ultra alto rendimiento, inversión automática de polaridad, intervención de arco configurable, etc. Debido a la amplia gama de requisitos para las fuentes de alimentación de prueba de alta tensión, le recomendamos que se ponga en contacto con nuestros expertos en aplicaciones para analizar sus especificaciones únicas Polaridad fija de montaje en PCB. SeriesPowerVoltage RangeMSA0.9W1kV - 3kVMS3W0kV - 3kVUM4W - 30W0kV - 6kVMódulos – Polaridad fija. SeriesPowerVoltage RangePMT1.9W - 4W0kV - 7.5kVUM8-404W - 30W8kV - 40kVMPD10W1kV - 30kVMPS10W1kV - 30kVMPS20W20W1kV - 10kVSMS60W1kV - 60kVUMW60W - 125W8kV - 20kVSLM300W - 1.2kW1kV - 70kVCCM1KW500W - 1kW1kV - 4kVCCM3.1kW4kVMódulos – Polaridad reversible. SeriesPowerVoltage RangeMX10PLUS0.1W10kVMX2.5PN0.15W2.5kVMXE0.5W - 2W2.5kV - 10kVMX8PLUS0.8W8kVMX101W10kVMX202W20kVMXR6W - 9W20kV - 30kVCZE200010W5kV - 30kVTOF300012W30kVUnidades de montaje en Rack.. SeriesPowerVoltage RangeCZE1000R9W30kVSL10W - 1.2kW1kV - 130kVSL150kV1.2kW150kVSL2KW2kW0kV - 50kVSLS2kW160kV - 360kVSTA4kW1kV - 70kVSTR6kW1kV - 150kVST12kW - 120kW1kV - 225kV 

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