In the semiconductor and liquid crystal panel manufacturing processes, vacuum chucks and mechanical chuck systems have conventionally been adopted. However, due to the effects of adsorption and equipment complexity, electrostatic chucks that utilize static electricity have been widely adopted to compensate for these drawbacks.
The electrostatic chuck has a structure in which electrodes are installed between insulating and a wafer is adsorbed and held by the Coulomb force generated by applying a high voltage to the electrodes.
The high-voltage power supply developed for electrostatic chuck applications includes bipolar outputs positive/negative high-voltage power supplies, output polarity reversal function for easier wafer chucking/de-chucking, function to detect chucking state of the wafer by capacitance measurement, analog and serial interfaces to interface with variety of systems, and high reliability with a high-voltage power supply that eliminates mechanical relays. Spelman has abundant design knowledge and manufacturing capabilities, and can also handle customized products that satisfy a variety of requirements.
Spelman has abundant design knowledge and manufacturing capabilities, and can also handle customized products that satisfy a variety of requirements.