2008 17th World Conference on Nondestructive Testing

September 23, 2008

Spellman High Voltage Electronics Corp. and Spellman High Voltage (SIP) Co. Ltd. are proud to announce that they will be exhibiting at the upcoming 17th World Conference on Nondestructive Testing, to be held on October 25-28, 2008 in Shanghai,2008 17th World Conference on Nondestructive Testing China, at the Shanghai Exhibition Center, Booth C355.

 

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